Affirm Journal of Heat and Mass Transfer

Affirm Journal of Heat and Mass Transfer is an international and peer-reviewed journal with an intercontinental advisory board. The journal documents the professional’s interest in any areas that connect to heat and mass transfer. The focus of the journal is on theories and practice in control scenario, experimental techniques, thermal modeling of electronics systems and components, environmental applications of heat and/or mass transfer, electronic and photonic cooling, and new methods of measuring and/or correlating transport. The editorial board of the Affirm Journal of Heat and Mass Transfer invites authors to submit original papers, case studies and review papers to the journal. At Affirm Journal of Heat and Mass Transfer, we expect the authors to abide Principles of Transparency and Best Practice in Scholarly Publishing suggested by The Committee on Publication Ethics (COPE), the Directory of Open Access Journals (DOAJ), the Open Access Scholarly Publishers Association (OASPA), and Scopus.

Scope and Focus

Base Board Design and Material Structure
Biological Heat and Mass Transfer
Combined Heat and Mass Transfer
Combustion and Reactive Flows
Conduction
Control Scenario
Electronic and Photonic Cooling
Electronics Packaging
Energy Engineering
Environmental Applications of Heat and/or Mass Transfer
Evaporation, Boiling, and Condensation
Experimental Techniques
Fan Design and Performance
Forced Convection
Heat Exchanger Fundamentals
Heat Sink Design and Optimization
Heat Storage
Heat Transfer Enhancement
Heat Transfer in Manufacturing
Heat Transfer in Micro Channels
High Heat Conductive Materials
Insulation
Interface Thermal Contact Performance
Jets, Wakes, and Impingement Cooling
Melting and Solidification
Microscale and Nanoscale Heat and Mass Transfer
Natural and Mixed Convection
New Methods of Measuring and/or Correlating Transport
Phase changing heat transfer
Porous Media
Property Data
Radiation
Spray Cooling
Temperature Stability
Thermal Modeling of Electronics Systems and Components
Thermal Systems
Two-Phase Flow and Heat Transfer
Various electronic devices

Editor in chief

Dr. Loghman

Abstracting and Indexing

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